In the past few years, Cadence revolutionized the way digital designers could solve their
design challenges by revamping the entire digital tool suite with key enhancements such
as integrated engines, massively parallel processing, and early signoff optimization, all
delivering faster turnaround time and best-in-class power, performance, and area (PPA)
optimization. In the era of FinFETs and advanced nodes, these innovations enabled our
customers to meet their stringent technical requirements and design chips that meet
aggressive PPA goals. These have proved beneficial to customers as they design current
and next-generation products. However, as we all know, the electronics-based world
never sleeps and the push into bigger and more complex designs is unrelenting.

For more information, please see the white paper.

https://www.cadence.com/content/dam/cadence-www/global/en_US/documents/tools/digital-design-signoff/best-full-flow-ppa-wp.pdf


감사합니다.